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Keywords
Eutectic system
Intermetallic
Materials science
Grain boundary
Thermal conductivity
Alloy
Eutectic bonding
Thermodynamics
Solid solution
Analytical Chemistry (journal)
Metallurgy
Chemistry
Microstructure
Composite material
Subject Areas
Electronic Packaging and Soldering Technologies
·Electrical and Electronic Engineering ·Physical Sciences
Aluminum Alloy Microstructure Properties
·Aerospace Engineering ·Physical Sciences
Intermetallics and Advanced Alloy Properties
·Mechanical Engineering ·Physical Sciences
Citations by Year
2017: 3
2018: 1
2019: 1
2024: 1
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