Abstract
A simple one dimensional model has been introduced to investigate the morphological instability observed in many solidification processes. It is shown that the solidified shell material with higher thermal conductivity might result in planar shell growth, whereas the mold material with higher thermal conductivity may cause irregular growth of the shell which, generally, causes cracking near the surface, and the thicker mold causes faster growth of the shell, and the higher thermal contact resistance leads to faster growth of the shell.
Keywords
Shell (structure)
Materials science
Instability
Cracking
Thermal conductivity
Mold
Planar
Thermal
Composite material
Metallurgy
Mechanics
Thermodynamics
Physics
Subject Areas
Solidification and crystal growth phenomena
·Materials Chemistry ·Physical Sciences
Aluminum Alloy Microstructure Properties
·Aerospace Engineering ·Physical Sciences
Metallurgical Processes and Thermodynamics
·Mechanical Engineering ·Physical Sciences
Citations by Year
2015: 1
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