Journal Article

·2004

Solving a layout design problem by analytic hierarchy process (AHP) and data envelopment analysis (DEA) approach

Umut R. Tuzkaya YTU , Arzum Eser YTU , Goner Argon

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Abstract

Today, growing amounts of waste due to fast consumption rate of products started an irreversible environmental pollution and damage. A considerable part of this waste is caused by packaging material. With the realization of this fact, various waste policies have taken important steps. Here we considered a firm, where waste Aluminum constitutes majority of raw materials for this fir0m. In order to achieve a profitable recycling process, plant layout should be well designed. In this study, we propose a two-step approach involving Analytic Hierarchy Process (AHP) and Data Envelopment Analysis (DEA) to solve facility layout design problems. A case example is considered to demonstrate the results achieved.

Keywords

Analytic hierarchy process Data envelopment analysis Realization (probability) Process (computing) Computer science Operations research Manufacturing engineering Environmental pollution Industrial engineering Engineering Mathematical optimization Mathematics Environmental science

Subject Areas

Advanced Manufacturing and Logistics Optimization ·Industrial and Manufacturing Engineering ·Physical Sciences
Color perception and design ·Social Psychology ·Social Sciences

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