Abstract
The following topics are dealt with: thermal management; heat spreading; LED packaging; multi-chip-module; stacked die; solders; thermal interface materials; hydrophilicity; hydrophobicity; evaporation; heat pipes; phononics; cooling; heat exchangers; nanoscale heat transport; heat sinks; phase change material; reliability; near junction thermal transport; power electronics and thermoelectrics.
Keywords
Table (database)
Computer science
Database
Subject Areas
Heat Transfer and Numerical Methods
·Computational Mechanics ·Physical Sciences
Phase-change materials and chalcogenides
·Materials Chemistry ·Physical Sciences
Advanced Thermoelectric Materials and Devices
·Materials Chemistry ·Physical Sciences