Journal Article

·2014

Use of nickel(II) acetylacetonate and dimethylgold(III) acetylacetonate in gold on nickel plating

Ahmet Ozan Gezerman YTU , Burcu Didem Çorbacıoğlu YTU

Surface Engineering

Abstract

This study investigates the use of non-toxic materials in nickel and gold plating baths that are used to plate gold on nickel plated stainless steel surfaces. The physical and mechanical stability and adhesion of the plating obtained using such compositions are investigated. The thickness, colour and adhesion of the plating have been studied using X-ray measurements, visible spectrometry and hydrogen embrittlement tests respectively. The plating baths employed in this study, which contained nickel(II) acetylacetonate and dimethylgold(III) acetylacetonate, were found to be good alternatives to conventional nickel and gold plating baths because they contain toxic nickel sulphate and cyanide salts.

Keywords

Nickel Plating (geology) Materials science Gold plating (software engineering) Metallurgy Cyanide Adhesion Electroless nickel plating Electroplating Electroless plating Composite material Layer (electronics)

Subject Areas

Corrosion Behavior and Inhibition ·Materials Chemistry ·Physical Sciences
Recycling and Waste Management Techniques ·Industrial and Manufacturing Engineering ·Physical Sciences
Electrodeposition and Electroless Coatings ·Electrical and Electronic Engineering ·Physical Sciences

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